Explore the foundational understanding of semiconductor packaging with Arizona State University and Intel. Gain insights into packaging design, manufacturing, and future challenges in the semiconductor industry.
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Get Started / More InfoSemiconductor Packaging covers essential concepts, manufacturing stages, and advanced technologies, providing comprehensive knowledge and skills for the semiconductor industry.
Introduction to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. Gain insights into historical observations and trends using Moores Law. Explore the anatomy and function of semiconductor packaging and recognize various types of packages and how they differ in materials, design, and reliability.
Learn about the various stages of semiconductor package manufacturing and the role of Process Control Systems. Understand how Process Control Systems can help identify and correct process problems and how to use control charts to monitor process performance.
Gain insights into the Introduction to Pathway for Assembly and Packaging technologies, the evolution, and impact of packaging on product performance and innovation in the semiconductor industry.
Learn about FEM and perform linear & nonlinear static analysis using SimScale. Gain hands-on experience in cloud-based simulation technology.
Material Extrusion is a comprehensive course diving into additive manufacturing techniques. Students will delve into fused deposition modeling and composite extrusion,...
This course delves into motion planning for robotic systems, covering graph-based methods, randomized planners, and artificial potential fields.
Single-Phase Pipe Hydraulics & Pipe Sizing course equips learners with comprehensive knowledge of fluid flow through pipes, pressure drop calculations, and piping...