This course delves into the intricate stages of semiconductor package manufacturing, covering sort, assembly, and final testing. Participants will gain insights into the role of Process Control Systems in semiconductor manufacturing and how they can identify and rectify process issues to uphold quality. The utilization of control charts for process performance monitoring is also thoroughly examined.
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The course modules cover topics such as semiconductor manufacturing processes, assembly, testing, and the role of Process Control Systems. Participants will also gain proficiency in using control charts for process performance monitoring.
Welcome to the course, where you will meet the experts and get acquainted with the reference guide to enhance your learning experience.
Gain an in-depth understanding of semiconductor package manufacturing, including the steps, technology, and flow involved in the process.
Explore the differences between BGA and LGA, two grid arrays used in semiconductor package manufacturing, to comprehend their distinct characteristics and applications.
Delve into the assembly process, particularly focusing on die bonding and the methods for placing a chip on a package substrate.
Learn about the importance of keeping IC packages cool during the assembly process to ensure optimal performance and reliability.
Discover the significance of product burn-in tests in semiconductor packaging manufacturing to assess the reliability and performance of the packages.
Understand the role of Process Control Systems (PCS) in semiconductor manufacturing and gain insights into interpreting control charts for process monitoring and improvement.
Conclude the course with a comprehensive summary, followed by an exam, and gain a sneak peek inside an Intel Sub Fab to witness real-world application.
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