Introducing multichip modules (MCM) and system-in-package (SIP) technologies, this module will discuss various types and packaging roadmaps, highlighting future directions in packaging.
This module introduces the course and outlines its objectives, providing an understanding of the multidisciplinary approach required in electronics systems packaging. It sets the foundation for subsequent modules by highlighting the importance of systems packaging in modern electronics.
This module delves into the definition of a system and traces the history of semiconductors. Understanding these concepts is crucial for grasping the evolution of electronics and the role packaging plays in the functionality of modern devices.
This module covers various products and levels of packaging in electronics. It highlights the diverse categories of packaging used in the industry and the implications for device performance and reliability.
Focusing on packaging aspects of handheld products, this module presents case studies that illustrate real-world applications. Students will learn about the challenges and solutions specific to handheld device packaging.
This module continues the examination of case studies and introduces the definition of printed wiring boards (PWB). A summary and review questions will reinforce the learned concepts, ensuring comprehension.
The basics of semiconductors are discussed along with a process flowchart. A video titled "Sand-to-Silicon" will enhance understanding of the semiconductor manufacturing process from raw material to finished product.
This module discusses wafer fabrication, inspection, and testing processes, which are critical for ensuring the quality and reliability of semiconductor devices prior to packaging.
This module covers wafer packaging, detailing the evolution of packaging methods and the various chip connection choices available in modern semiconductor technology.
This module addresses wire bonding, tape automated bonding (TAB), and flip chip technologies. These connection methods are vital for achieving reliable electrical connections in integrated circuits.
Continuing the discussion on wire bonding, TAB, and flip chip methods, this module includes tutorials that provide practical insights into these packaging technologies.
This module answers the question of why packaging is crucial in electronics. It also introduces single chip packages or modules (SCM) as a packaging solution for modern applications.
Students will learn about commonly used packages and advanced packaging solutions. The materials utilized in these packages will also be discussed, emphasizing their importance for performance.
This module continues the discussion on advanced packages, covering thermal mismatch issues and current trends in packaging technology that impact device performance.
Introducing multichip modules (MCM) and system-in-package (SIP) technologies, this module will discuss various types and packaging roadmaps, highlighting future directions in packaging.
This module examines electrical issues in packaging, beginning with resistive parasitics, which can impact performance. Understanding these concepts is crucial for effective packaging design.
Continuing the discussion on electrical issues, this module covers capacitive and inductive parasitics that can affect circuit behavior, providing essential knowledge for designers.
This module discusses layout guidelines to mitigate electrical issues and addresses reflection problems that can occur in high-speed circuits, promoting effective design practices.
Focusing on interconnection, this module discusses various methods and challenges associated with ensuring robust and reliable connections within electronic systems.
This module provides a quick tutorial on packages, highlighting the benefits of Computer-Aided Design (CAD) in packaging. It introduces concepts like Design for Manufacturing (DFM), Design for Reliability (DFR), and Design for Testability (DFT).
Components of a CAD package are discussed in this module, focusing on highlights that enhance the design process. Students will gain insights into the tools that streamline packaging design.
This module addresses design flow considerations, emphasizing the importance of starting circuit design with schematic work to ensure a solid foundation for the project.
In this module, students will engage in demonstrations and examples of layout and routing. Additionally, technology file generation from CAD will be covered, enhancing practical understanding.
This module reviews CAD output files essential for PCB fabrication, including photo plotting and mask generation. Students will understand the significance of these files in the production process.
Focusing on process flowcharts, vias, and printed wiring board (PWB) substrates, this module provides insight into the essential components of PCB manufacturing processes.
This module continues the discussion on substrates, featuring video highlights that enhance understanding of surface preparationâan important aspect of PWB manufacturing.
This module provides detailed insights into photoresist application methods, UV exposure, and developing processes, crucial for effective PCB fabrication.
Students will learn about PWB etching, resist stripping, and screen-printing technology, which are critical processes in the manufacturing of printed circuit boards.
This module addresses through-hole manufacture process steps, including panel and pattern plating methods, which are important for creating reliable connections in PCBs.
This module offers video highlights on manufacturing processes, covering solder masks for PWBs and the intricacies of multilayer PCBs, essential for modern electronics.
This module presents microvia technology and the sequential build-up technology process flow for high-density interconnects, crucial for developing advanced PCB designs.
In this module, students will compare conventional and high-density interconnect (HDI) technologies, including flexible circuits, which offer innovations in PCB design and application.
This module discusses the benefits of surface mount devices (SMD), design issues related to SMDs, and provides an introduction to soldering techniques.
This module covers reflow and wave soldering methods, essential for attaching surface mount devices to PCBs. It emphasizes techniques that ensure reliability in solder connections.
This module discusses the types of solders, their wetting properties, the role of flux, and defects that can occur in wave soldering processes, emphasizing quality control.
This module introduces vapor phase soldering, ball grid array (BGA) soldering, and desoldering/repair techniques. Understanding these methods is crucial for maintaining PCB integrity.
This module provides insights into SMT failures, including a library of common issues and the phenomenon of tin whiskers, which can impact reliability in soldered connections.
This module discusses tin-lead and lead-free solders, their phase diagrams, and thermal profiles for reflow soldering, providing essential knowledge for soldering technology.
This module addresses considerations for lead-free solders, green electronics initiatives, RoHS compliance, and issues related to e-waste recycling, emphasizing sustainability in electronics.
This module explores thermal design considerations in systems packaging, emphasizing the importance of thermal management for reliability and performance of electronic devices.
This module introduces embedded passives, explaining their significance in modern electronics. The need for embedded passives and their design library will also be discussed.
This module focuses on embedded capacitors, detailing the processes for embedding them and providing case study examples that illustrate their applications in electronics.
This final module provides a chapter-wise summary of the course content, reinforcing key learnings and concepts discussed throughout the course, ensuring students have a comprehensive understanding.